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Product Introduction
The HL-7900 X-ray Inspection Equipment is based on the principle that X-rays attenuate to different degrees when penetrating materials of different densities and thicknesses, enabling non-destructive fluoroscopic imaging inspection of the sample under test. The X-ray source emits X-rays that pass through the sample, and the detector receives the transmitted rays and converts them into digital images, thereby allowing observation of the internal structure without damaging the sample. The equipment is suitable for internal defect inspection of SMT solder joints (BGA, CSP, QFN, flip chip, etc.), IC and semiconductor packages, connectors, lithium batteries and other workpieces, and can be used to detect issues such as cold solder joints, open solder joints, solder bridging, solder ball voids and bubbles, cracks, broken traces and internal foreign matter.
Product Features