Product Overview
The Nordson DAGE 4000Plus is an advanced solder strength tester on the market, delivering excellent data accuracy and repeatability. Whether in the semiconductor industry or in automotive, power, hybrid, or high-reliability microelectronics industries, the 4000Plus demonstrates versatility and precision, giving users greater confidence in product quality. The system incorporates the latest patented solder strength testing technologies (such as the anti-rebound system), with a test range from 250 mg to 500 kg, suitable for standard and specialized applications.
Core Capabilities
- Pull Testing: wire pull, tweezer peel, cold bump pull/hot bump pull, die pull, flip chip pull, copper pillar pull, vertical pillar pull, with high-strength pull up to 100 kg
- Shear Testing: ball bond/wedge bond shear, standard die shear, low-profile die shear, high-strength die shear, copper pillar/micro-bump shear, pillar bump shear, typically up to 200 kg, and up to 500 kg with dedicated fixtures
- Push and Compression Testing: compression test module up to 50 kg
- Vector and Fatigue Testing: vector pull (VP series) and fatigue tensile/shear analysis for evaluating solder joint reliability
- Passivation Layer Shear: software combined with a specially designed shear tool to solve shear force testing at restricted passivation layer locations
Precision and Traceability
- Overall system accuracy is ±0.1% of the selected range
- Patented anti-rebound system maintains 1 μm level precision of shear height across the entire test range; the S25G test module offers reset accuracy up to ±0.25 μm (verified by laser measurement)
- Calibrated according to international standards (O.I.M.L class M1 tolerance standard; optional UKAS or NIST class 1 weights), with complete and traceable data
- Paragon™ software: automatic GR&R calculation, built-in diagnostics, chart and database search wizard, personalized reports
Imaging and Workstage
- Image capture camera (built-in light source, usable for automated datum alignment), aperture imaging system (medical endoscope technology, suitable for fine wire bonds/micro-bumps/copper pillars), trinocular camera (compatible with any C-mount stereo microscope), side calibration camera (suitable for copper pillar bumps, micro-bumps, TSV)
- XY stage from 160×160 mm to 300×210 mm, with high-precision high-speed regional shear force option; optional heated stage (up to 400 ℃, 200 kg testing)
- Z-axis travel 75 mm, standard vertical working range 120 mm
- Multi-function test module (MFC) enables application switching within seconds, supporting multi-surface testing of complex hybrid packages
Main Compliant Standards
- JEITA EIAJ ET-7407 / IPC-9708 (cold bump pull/hot bump pull)
- JEDEC JESD22-B117A (BGA copper pillar shear), JESD22-B115 (cold bump pull), JESD22-B116 (gold ball shear), JESD22-B109 (flat pull)
- ASTM F1269 (ball bond shear), MIL STD 883 (wire pull / flip chip pull / DT·NDT)
- Manufactured in compliance with ISO 9001, Machinery Safety Directive, Low Voltage Directive, EMC regulations, SEMI Safety Guidelines (S2), as well as RoHS and UL design requirements
Basic Specifications
- Test ModulesPull: P25/P100/P500/P1KG/P10KG/P50KG/P100KG; Shear: S25/S250/S250R/S2.5KG/S5KG/S5KGR/S20KG/S50KG/S200KG
- DimensionsW 630 mm (including left and right joysticks) × D 600 mm × H 830 mm
- WeightApprox. 90 kg (including XY stage)
Note: The above specifications are subject to the manufacturer's latest information; for special requirements such as the 500 kg high-strength shear fixture, please consult our company.
