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TESCAN MIRA General Purpose Field Emission SEM

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TESCAN MIRA General Purpose Field Emission SEM
Failure Analysis › Scanning Electron Microscope

TESCAN MIRA General Purpose Field Emission SEM

TESCAN MIRA is the latest fourth-generation high-performance general purpose field emission scanning electron microscope (SEM).

Category: Failure Analysis › Scanning Electron MicroscopeBrand: TESCAN319 views
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                                   ​TESCAN MIRA General Purpose Field Emission SEM​​

TESCAN MIRA is the newly launched fourth-generation high-performance general-purpose field emission scanning electron microscope (SEM), equipped with a high-brightness Schottky field emission electron gun. It enables SEM imaging and real-time elemental analysis in the same window of the TESCAN Essence™ operating software, and is widely used in quality control, failure analysis and routine material inspection in laboratories.

Main Advantages

  • Fully integrated TESCAN Essence™ EDS analysis platform, enabling SEM imaging and real-time elemental analysis in the same window
  • Unique aperture-free optical design and real-time In-flight Beam Tracing™ technology for quickly obtaining optimal imaging and analysis conditions
  • Unique Wide Field Optics™ design with minimum magnification as low as 2X, enabling precise sample navigation without an additional optical navigation camera
  • SingleVac™ mode as standard, allowing direct observation of non-conductive or electron-beam-sensitive samples without coating
  • Intuitive modular Essence™ software, easy to operate for users of different experience levels
  • Essence™ 3D collision prevention model, ensuring the safety of detectors in the sample chamber during stage and sample movement
  • Optional in-column SE and BSE detectors and beam deceleration technology to enhance low-voltage imaging performance
  • Standard analysis platform, optionally integrated with a variety of detectors and accessories (such as cathodoluminescence detectors, water-cooled backscattered electron detectors, Raman spectrometers, etc.)

System Configuration: single-beam system (SEM), field emission electron gun, beam deceleration technology, integrated energy dispersive spectroscopy, in-column detectors, variable vacuum MultiVac.

Imaging and Analysis: four different contrast signals can be obtained: in-chamber SE, in-chamber BSE, in-column SE and in-column BSE; beam deceleration technology further enhances low-voltage imaging capability. SingleVac™ mode is standard, with TESCAN preset vacuum values, allowing observation of charged samples without coating.

Main Applications: submicron characterization of routine materials, materials research, quality control and failure analysis.



Technical Specifications

Electron beam columnFEG-SEM column
Electron sourceSchottky field electron emitter
Electron beam resolution1.2 nm @ 30 kV; 1.0 nm @ 30 keV (In-Beam SE); 3.5 nm @ 1 keV (In-Beam SE); 1.8 nm @ 1 keV with sample bias (BDT)
Magnification2x to 1,000,000x
Landing energy range200 eV - 30 keV (< 50 eV with BDT)
Probe current2 pA – 400 nA, continuously adjustable
Standard detectorsSE detector (Everhart-Thornley); chamber view (IR) camera
Optional detectorsIn-Beam SE; In-Beam LE-BSE; R-BSE; LE-BSE; 4Q LE-BSE; HADF R-STEM; CL detectors; ONCam; GSD
Optional analyzersTescan (Dual) Essence EDS; 3rd-party EDS/EBSD/WDS; RISE confocal Raman
ChamberGM chamber (20+ ports)
StageMotorized 5-axis compucentric stage
X & Y travel130 mm
Z travel100 mm
RotationCompucentric, 360° continuous
Tilt rangeCompucentric, -70° to +90°
Max. specimen height92 mm (133 mm without stage rotation)
Max. specimen size180 mm diameter with full XY moves, rotation, no tilt
Max. specimen weight8,000 g (full XYZ); 1,000 g (full XYZRT)
Vacuum system / modesOil-free pumps; MultiVac up to 700 Pa (N2 or H2O); SingleVac 30+/-10 Pa
SoftwareTESCAN Essence™ software; Essence™ 3D Collision Model

Specifications compiled from the manufacturer's official documentation; the delivered configuration and its datasheet prevail.

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