Product Overview
The newly designed F&S 53XX BDA semi-automatic fine-wire bonder is aimed at users who must ensure bonding quality under tight budget constraints: it is suitable for laboratory R&D, product prototype trial production, product evaluation, and rework. Excellent loop control and tail-wire precision benefit from a high-speed Y-axis motor with 20 mm travel and full programmability, making it especially suitable for low-loop bonding of microwave devices, ensuring process reproducibility and eliminating human factors.
Core Features
- Two Processes in One Machine: The same bonding head enables gold wire ball bonding and deep-cavity wedge bonding, with simple process switching (raise the flame-off electrode, replace the wedge-bonding fine wire, and secure the wire clamp).
- Stepped Wire Clamp System: The first wire clamp is located above the wedge bond and the second wire clamp at its bottom, ensuring tail-wire reliability and consistency even with thicker bonding wires.
- Programmable Parameters: All parameters can be programmed and stored on the built-in hard disk; combined with a color LCD monitor and the F&S standard thumbwheel, operation is intuitive.
- Switchable Ultrasonic System: Software switching between 60 kHz and 100 kHz accommodates different bonding substrates; the transducer can be quickly replaced on site.
- Multiple Operating Modes: From manual step mode to automatic production mode, the operator only needs to move the capillary to the bonding position and press a key to complete the entire bonding process, which can be mastered with simple training.
- High Consistency with 5310/5330/5350: Similar hardware and software operation saves training and maintenance costs and facilitates a smooth future transition to mass production.
- Supports complex looping modes such as reverse bonding and continuous bonding.
Technical Specifications
- Wire SizeBall bonding: gold wire 17.5–50 μm (2" spool, other spools optional); wedge bonding: gold/aluminum wire 17.5–75 μm; gold ribbon 30×12.5–250×25 μm
- Bonding HeadFine-wire ball bonding or wedge bonding; ball-bonding capillary length 9–16 mm, wedge-bonding capillary length 1/2" or 1"
- Bonding ForceProgrammable 5–150 cN; voice-coil bonding force control system; non-contact touchdown sensor
- Ultrasonic System60 kHz, optional 100 kHz
- Control SystemSingle-board PC, Windows operating system; 6.5" TFT monitor (640×480); thumbwheel with keys for quick operation and programming
- Control ModesManual and semi-automatic production modes; programmable linear test
- LoopingStandard rectangular, reverse, and stitch loops, all programmable
- AxesZ-axis 60 mm travel (step accuracy 1 μm); Y-axis 20 mm travel (step accuracy 2 μm); XY stage working area 18×18 mm (with key-operated mouse, 1:7 ratio to stage)
- Heating StageDigital control; standard 80 mmØ, maximum usable sample 2"×2", vacuum hold-down, up to 250 ℃; optional 95 mmØ or 4"×4", up to 200 ℃
- Dimensions/WeightW 630 × D 580 × H 400 mm; net weight 40 kg
- Power Supply100–240 VAC, single phase, 50/60 Hz, maximum power consumption 230 W; vacuum tube diameter Ø6 mm (standard)
Note: The above specifications are subject to the manufacturer's latest information. Please contact us for detailed selection advice and a demonstration.
