CMI165 Copper Thickness Measurement…-Holy Instrument

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CMI165 Copper Thickness Measurement Instrument

Reliability Test › Coating & Film Thickness Measurement

CMI165 Copper Thickness Measurement Instrument

CMI165 copper thickness measurement instrument uses micro-resistance four-probe method for non-destructive measurement of PCB chemical copper and electroplated copper thickness.

Category: Reliability Test › Coating & Film Thickness MeasurementBrand: HITACHI 日立130 views

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Product DetailsDETAILS

Product Introduction

The CMI165 Copper Thickness Measurement Instrument (formerly an Oxford Instruments product, now manufactured and sold by Hitachi High-Tech) is a portable copper thickness gauge designed specifically for the PCB manufacturing and electroplating industries. The instrument uses the micro-resistance method with a dedicated four-point probe to measure copper layer thickness. Featuring temperature compensation, it can measure directly whether the copper board is hot or cold without being affected by copper temperature, enabling rapid in-process inspection. It is suitable for incoming inspection, copper thickness sorting before and after drilling and plating, and quantitative evaluation of circuit copper thickness after etching.

Main Technical Specifications

Measurement principle: Micro-resistance method (four-point probe resistance measurement)
Measurement objects: PCB surface copper, circuit copper after etching, copper foil and copper-clad laminate copper thickness
Copper thickness measurement range: Electroless copper 0.25-12.7μm; electroplated copper 2-254μm
Temperature compensation: Built-in temperature compensation, direct measurement on both hot and cold boards
Measurement units: μm, mil or oz (copper weight), switchable display
Measurement probe: Dedicated SRP-T1 replaceable probe with tip illumination for easy positioning
Measurement modes: Static mode and continuous mode
Calibration: Factory calibrated with certificate; no recalibration required after replacing probe tip
Operating interface: English or Simplified Chinese selectable
Power supply: AA battery powered, portable design, protective case included
Compliant standards: EN 14571

Technical Specifications

Measurement technique	Microresistance, 4-point electrical probe method
Copper thickness range (electroless)	0.25 – 12.7 µm (0.01 – 0.5 mil)
Copper thickness range (electroplated)	2 – 254 µm (0.1 – 10 mil)
Fine etched traces	Measures thin etched traces down to 204 µm without standards
Unit selection	Selectable μm, mils or oz
Probe	Proprietary SRP-T1 replaceable probe; tip replaceable without recalibration
Temperature compensation	Supported; measures Cu on hot or cold PCBs
Measurement mode	Static or continuous mode
Statistical analysis	Data recording, average, standard deviation, high-low report
Calibration	Factory calibrated and certified
Compliance	EN 14571 (4-point electrical probe resistance method)
Power	Powered by AA batteries
User interface language	English or Simplified Chinese