FISCHERSCOPE X-RAY XDV-μ PCB Coating…-Holy Instrument

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FISCHERSCOPE X-RAY XDV-μ PCB Coating Thickness Gauge

German FISCHER FISCHERSCOPE X-RAY XDV-μ PCB micro-focus X-ray coating thickness measurement instrument.

Category: Reliability Test › Coating & Film Thickness MeasurementBrand: FISCHER 菲希尔258 views

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Product DetailsDETAILS

FISCHERSCOPE X-RAY XDV-μ PCB is a micro-focus X-ray fluorescence (XRF) coating thickness gauge from FISCHER (Germany), designed specifically for the PCB industry for coating thickness measurement and material analysis.

Typical Applications

PCB surface treatment coating thickness measurement: Electroless Nickel Immersion Gold (ENIG), electroplated nickel/gold, tin plating, silver plating, etc.
Simultaneous measurement and thickness analysis of multilayer coatings
Material composition analysis (spectral analysis function)

Main Functions (based on original operation manual FISH-OM-27 VER.01/2019)

Instrument introduction and parameter setting
Power-on procedure and warm-up
Test program selection
Calibration, normalization and substrate correction
Test procedure and sample placement orientation
Report template editing and quick printing
Data set management (deleting readings, closing data sets)
Measurement time and reading unit switching
Spectral analysis

Supplied with the original operation manual, providing guidance on instrument operation, calibration and routine maintenance; suitable for coating quality control in PCB manufacturing and QA laboratories.

Technical Specifications

Measurement principle	Energy dispersive X-ray fluorescence (EDXRF) with polycapillary optics
Element range	Al (13) to U (92), up to 24 elements simultaneously
Application	Automated coating thickness/composition measurement on PCBs up to 610 x 610 mm
Analyzed coatings	Very thin coatings, e.g. Au/Pd ≤ 0.1 µm
X-ray tube	Standard: micro-focus W tube (Be window); optional micro-focus Mo tube
High voltage	Three steps: 10 kV, 30 kV, 50 kV
Primary filter	4x changeable: Ni 10 µm; free; Al 1000 µm; Al 500 µm
Measurement spot	Approx. Ø 20 µm or Ø 10 µm (fwhm at Mo-Kα)
X-ray detector	Peltier-cooled silicon drift detector (SDD)
Effective detector area	20 mm² or 50 mm²
Sample stage	Fast programmable XY-stage; optional vacuum fixation table
Usable sample area	600 x 600 mm
Maximum travel	450 x 300 mm
Max. travel speed (XY)	60 mm/s
Repeatability (XY)	≤ 5 µm, direction-independent
Sample weight / height	5 kg max. / 10 mm max.
Video microscope	High-resolution CCD color camera, manual/auto focus, grid, crosshairs, class 1 laser pointer
Power supply	AC 115 V or 230 V, 50/60 Hz, max. 120 W
Protection class	IP40
Dimensions (W x D x H)	670 x 885 x 660 mm
Weight	Approx. 156 kg
Operating environment	10 °C – 40 °C, RH ≤ 95 %
Software	Standard: Fischer WinFTM® BASIC (incl. PDM®); optional WinFTM® SUPER
Standards	DIN ISO 3497, ASTM B 568; CE: EN 61010, EN 61326