Product Introduction
The metallographic cross-section acrylic mounting resin kit (also known as cold mounting resin or acrylic cold mounting set) is a two-component room-temperature curing mounting material based on imported acrylic resin, consisting of acrylic powder and a matching hardener (curing agent). When in use, the two components are mixed evenly in proportion and poured into a mold, where they cure rapidly at room temperature, embedding small, irregular or complex-shaped metallographic specimens into regular standard specimens for subsequent grinding and polishing, etching and microscopic observation. This product is widely used in PCB, FPC, semiconductor, microelectronics, optoelectronics and general metallographic cross-section specimen preparation fields.
Main Technical Parameters
- Product composition: acrylic powder (acrylic resin powder) + hardener (curing agent), two components
- Appearance: powder is white (particle size approx. below 100 microns); hardener is a colorless to pale yellow transparent liquid
- Mixing ratio: powder and hardener mixed at a weight ratio of approx. 3:1
- Curing method: room-temperature cold mounting, no heating, pressure or dedicated mounting machine required
- Curing time: fully cured in approx. 7 to 10 minutes at room temperature
- Appearance after curing: transparent and colorless, allowing clear observation of specimen morphology details
- Main properties: high hardness, good toughness, extremely low shrinkage, acid and alkali resistance, no discoloration during long-term storage
- Penetration: low viscosity and good flowability, excellent penetration into small holes and recesses, contains a defoaming agent
- Applicable molds: all currently known soft or hard plastic molds
- Applicable fields: metallographic cross-section specimen preparation in PCB, FPC, semiconductor, microelectronics, medical technology, optoelectronic technology and other fields
