Epoxy Resin TOPPER, HL1805-14A, HL5223-6B

Product Introduction

Epoxy TOPPER (Resin HL1805-14A / Hardener HL5223-6B) is a two-component epoxy cold mounting resin designed for room-temperature embedding of metallographic cross-section specimens. During use, the resin is mixed with the matching hardener in the specified ratio and poured into a mold, where it cures slowly at room temperature to form a highly transparent, low-shrinkage mounting block that provides excellent support and protection for specimen edges, coatings, platings, and pore structures. The epoxy system cures gently with a low exothermic peak temperature, making it particularly suitable for temperature-sensitive materials such as PCB cross-sections, electronic components, platings and spray coatings, and porous or fragile specimens. It can also be used with vacuum impregnation to allow the resin to fully penetrate specimen pores and cracks.

Product Features

• Two-component epoxy system, room-temperature cold mounting, no heating or pressure equipment required
• Highly transparent after curing, allowing clear observation of internal structures and interface details of specimens
• Gentle curing with low heat release, suitable for embedding heat-sensitive and low-melting-point materials
• Low viscosity and strong penetration, suitable for vacuum impregnation of porous specimens and spray coatings
• Low shrinkage and strong adhesion, providing excellent edge protection (edge retention)
• Suitable for PCB/FPC cross-sections, electronic components, platings, spray coatings, minerals, and composite materials