Reflow Oven, IR Oven

Product Introduction

The reflow oven is the core soldering equipment of the SMT surface mount production line. Its principle is to heat the paste solder pre-printed on the PCB pads so that it re-melts and wets the pads and component leads, thereby forming reliable mechanical and electrical connections between components and the circuit board. Infrared (IR) reflow ovens use radiant heating as the primary heat transfer method, often supplemented by forced hot air circulation. They can be used for reflow soldering of both leaded and lead-free solders, and are widely applied in mass production scenarios such as consumer electronics, communication equipment and automotive electronics.

Product Features

• Primarily infrared radiant heating, combined with hot air circulation to improve temperature uniformity
• Four stages: ramp-up, preheat/soak (activation), reflow soldering and cooling; the temperature profile can be set according to solder and board requirements
• Multiple temperature zones with independent control, combined with conveyor speed adjustment, accommodating different board thicknesses and component heat capacity differences
• Can meet the higher reflow peak temperatures required for lead-free solder, with an adjustable process window
• Optional nitrogen atmosphere to reduce solder joint oxidation and improve soldering quality
• Suitable for forming a continuous SMT production line with printers, placement machines, AOI and other equipment